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10AS032E2F27E1HG

Type	Description
rohs:	RoHS
speed:	1.5GHz
ram size:	256KB
flash size:	-
part status:	Active
peripherals:	DMA, POR, WDT
architecture:	MCU, FPGA
connectivity:	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
core processor:	Dual ARM? Cortex?-A9 MPCore? with CoreSight?
package / case:	672-BBGA, FCBGA
primary attributes:	FPGA - 320K Logic Elements
operating temperature:	0°C ~ 100°C (TJ)
supplier device package:	672-FBGA, FC (27x27)